ASTM F542-2007 电子元件和微电子元件封装用电器外封胶的放热温度用标准试验方法
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【英文标准名称】:StandardTestMethodforExothermicTemperatureofEncapsulatingCompoundsforElectronicandMicroelectronicEncapsulation
【原文标准名称】:电子元件和微电子元件封装用电器外封胶的放热温度用标准试验方法
【标准号】:ASTMF542-2007
【标准状态】:现行
【国别】:
【发布日期】:2007
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:D09.01
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:电器外封胶;电子工程;外壳;微电子学;温度;测试
【英文主题词】:electronic;encapsulatingcompounds;exothermictemperature;microelectronicencapsulation
【摘要】:Heatgeneratedbyareactingliquidencapsulatingcompoundhasthepotentialtocausedamagetoheat-sensitiveelectroniccomponents.Degradationoftheencapsulatingcompoundhasthepotentialtoalsooccurathightemperatures.Properselectionofanencapsulatingcompoundincludesknowledgeofitsexothermictemperaturetoprecludedamagetocomponents.Sincetheexothermictemperatureofareactingencapsulatingcompoundvarieswiththevolumeandgeometryofmaterial,itisessentialthatthevolumeandgeometrybespecifiedinanydetermination.Selecttheappropriatevolumeandgeometry.Theexothermictemperatureismeasuredinsufficientlypreciseandreproducibleformtoallowforapplicationevaluation,qualitycontrol,andencapsulatingcompoundcharacterization.Exothermictemperatureriseoftwodifferentvolumesofthesamematerialusingthesamegeometryindicatestheeffectofvolume.Materialsmaybecomparedbytestingequalvolumesofeachmaterialusingthesamegeometry.1.1Thistestmethodprovidesresultsthatarerelatedtothemaximumtemperaturereachedinaspecificvolumebyareactingliquidencapsulatingcompound,andthetimefrominitialmixingtothetimewhenthispeakexothermictemperatureisreached.1.2Thistestmethodprovidesameanstomeasurethepeakexothermictemperatureofanencapsulatingcompound.Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.ForspecifichazardstatementsseeSection8.Note1ThereisnoequivalentIECstandard.
【中国标准分类号】:L10;G39
【国际标准分类号】:31_240
【页数】:3P.;A4
【正文语种】:
【原文标准名称】:电子元件和微电子元件封装用电器外封胶的放热温度用标准试验方法
【标准号】:ASTMF542-2007
【标准状态】:现行
【国别】:
【发布日期】:2007
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:D09.01
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:电器外封胶;电子工程;外壳;微电子学;温度;测试
【英文主题词】:electronic;encapsulatingcompounds;exothermictemperature;microelectronicencapsulation
【摘要】:Heatgeneratedbyareactingliquidencapsulatingcompoundhasthepotentialtocausedamagetoheat-sensitiveelectroniccomponents.Degradationoftheencapsulatingcompoundhasthepotentialtoalsooccurathightemperatures.Properselectionofanencapsulatingcompoundincludesknowledgeofitsexothermictemperaturetoprecludedamagetocomponents.Sincetheexothermictemperatureofareactingencapsulatingcompoundvarieswiththevolumeandgeometryofmaterial,itisessentialthatthevolumeandgeometrybespecifiedinanydetermination.Selecttheappropriatevolumeandgeometry.Theexothermictemperatureismeasuredinsufficientlypreciseandreproducibleformtoallowforapplicationevaluation,qualitycontrol,andencapsulatingcompoundcharacterization.Exothermictemperatureriseoftwodifferentvolumesofthesamematerialusingthesamegeometryindicatestheeffectofvolume.Materialsmaybecomparedbytestingequalvolumesofeachmaterialusingthesamegeometry.1.1Thistestmethodprovidesresultsthatarerelatedtothemaximumtemperaturereachedinaspecificvolumebyareactingliquidencapsulatingcompound,andthetimefrominitialmixingtothetimewhenthispeakexothermictemperatureisreached.1.2Thistestmethodprovidesameanstomeasurethepeakexothermictemperatureofanencapsulatingcompound.Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.ForspecifichazardstatementsseeSection8.Note1ThereisnoequivalentIECstandard.
【中国标准分类号】:L10;G39
【国际标准分类号】:31_240
【页数】:3P.;A4
【正文语种】:
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